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Characterization of integrated circuit packaging materials

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BookPublisher: Buterworth-heinman 1993Description: 174.DDC classification: 621.89 GLA

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Item type	Current location	Call number	Status	Date due	Barcode
Books	Delhi Technological University In case any user is not receiving email during issue and return of books or not getting alerts for return of books .Kindly contact library and update your email and mobile .	621.89 GLA (Browse shelf)	Available		89773

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Previous	621.89 DOW TRIBOLOGICAL RESEARCH & DESIGN FOR ENGINEERING SYSTEMS	621.89 FOR LABRICATION OF INDUSTRIAL AND MARINE MACHINERY	621.89 FUL Theory and practice of lubrication for engineers	621.89 GLA Characterization of integrated circuit packaging materials	621.89 HER Theory and research in lubrication	621.89 HIR FUNDAMENTALS OF ENGINEERING TRIBOLOGY	621.89 HIR FUNDAMENTALS OF ENGINEERING TRIBOLOGY	Next

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